Embedded DRAM Full seminar Topic Free download here-Abstract

The three commonly identified types of embedded DRAM are DRAM based, blended (or hybrid), and logic- based. DRAM-based I is practically the same as commodity DRAM—using DRAM periphery devices to build logic circuitry with perhaps the addition of one or two metal layers for logic routing. Blended technology uses additional front-end masks to enhance the performance of the DRAM periphery devices, to speed up logic performance. Logic-based embedded DRAM enables transisters with performance compatible with leadingedge logic processes, resulting in an improved DRAM logic interface, and an onchip logic performance path to implementing system on-chip designs. System designers are turning to embedded DRAM for several reasons. Unlike commodity DRAMs, which are only available in a standard range of densities—typically 4, 16 and 64 Mbits—-the exact amount of memory required in a system can be specified in .the embedded DRAM macro block, for example, 5, 9, or 17 Mbits. Thus, no memory is wasted and area and cost are opt In addition, the exact configuration and memory interfaces can be specified in the macrocell, thus offering flexibility and optimum system performance.

Each of these three types combines the functions of both memory and logic on a single die. The elimination of the additional I/O bonding pads required for two separate chips saves about 5 to 10 percent of overall silicon area over discrete solutions. It can also help relieve the pad limitation problem of complex ICs by providing pad savings over discrete ICs, since DRAM driving pads are eliminated from both memory and logic parts. Depending on the particular design, an embedded array requires far fewer pads, thus saving space. This space saving is even more significant for smaller designs of 300K logic gates arid below, because it alleviates the pad limitation problem common in these designs.

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